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半導體電子零件運輸防護系統建議方案

2026-07-14

Semiconductor Electronic Components Transportation Protection System Proposal
半導體電子零件運輸防護系統建議方案

Project Overview 專案需求評估說明

After requirement confirmation, based on extensive experience serving semiconductor equipment, electronic measurement instruments, high-end electronic components, and precision devices, we propose the following transportation protection solution for PCB and electronic component logistics.

經雙方需求確認後,依據我司長期服務半導體設備、高階電子零組件、電子量測設備、自動化設備及精密儀器產業之實務經驗,提出以下專業建議方案供參考。

1. Recommended Case Platform 建議箱體配置

Recommended Model: Pelican 1730 Protector Case

Advantages:

• High-strength structural protection
• Excellent dust, moisture and impact resistance
• Integrated wheel system for factory logistics
• Modular interior layout for different electronic products
• Proven solution for semiconductor and precision equipment transportation


建議優先採用 Pelican 1730 作為標準化運輸平台,具備高強度防護、防震、防塵、防潮及模組化配置優勢。

2. Lean Management Strategy 精實管理導向規劃

The objective is not only transportation protection but also the establishment of a standardized logistics circulation system.

Benefits:

• Reduce unpacking and repacking operations
• Improve production flow efficiency
• Minimize handling risks
• Increase warehouse and logistics productivity


本專案核心並非單純提供運輸箱體,而是透過標準化周轉載具建置,協助客戶導入 Lean Management 精實管理模式。

3. ESD Protection System 防靜電保護方案

Material Specification:

• Surface Resistance: 10⁷ ~ 10¹¹ Ω
• Static Dissipative EVA Foam
• Suitable for PCB and electronic component protection
• CNC customizable processing


System Structure:
ESD Bag + ESD EVA Foam + Protective Transport Case

採用 ESD 防靜電 EVA 泡棉搭配既有防靜電袋,形成完整三級防護架構。

4. Modular Design 模組化周轉設計

One Case, Multiple Modules

Future product changes only require replacing foam modules instead of purchasing new transport cases.

同一箱體搭配不同泡棉模組,可有效降低後續採購、倉儲及管理成本。

5. Project Execution Plan 專案執行規劃

Phase 1 – Prototype Development

• Transport case
• ESD EVA foam
• CNC machining
• Layout planning
• Assembly and validation


Phase 2 – Site Testing & Optimization

Phase 3 – Production Deployment

建立標準化電子零件周轉系統,提升物流效率、生產效率及防護可靠性。


HY Performing Case
Deployment-Ready Protection System Solution Provider